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Something You Should Know About Rigid PCB

FastLink Circuits
July 31, 2022

Features of Rigid PCB

Printed circuit boards can be divided into rigid PCBs and flexible printed boards according to the production materials. rigid PCB has phenolic paper laminate, epoxy paper laminate, polyester glass felt laminate, epoxy glass cloth laminate. Common thicknesses of rigid PCBs are 0.2mm, 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, etc.

Rigid circuit boards have the following characteristics:

1. High density: For more than 100 years, the high density of printed boards can be developed with the improvement of integrated circuit integration and the advancement of installation technology.

2. High reliability: Through a series of inspections, tests and aging tests, the PCB can be guaranteed to work reliably for a long time (usage period, generally 20 years).

3. Designability: For various performance requirements of PCB (electrical, physical, chemical, mechanical, etc.), PCB design can be realized through design standardization and standardization, with short time and high efficiency.

4. Productivity: With modern management, standardization, scale (quantification), automation and other production can be carried out to ensure the consistency of product quality.

5. Testability: Establish relatively complete test methods, test standards, various test equipment and instruments, etc. to detect and identify the qualification and service life of PCB products.

The Effect of Rigid PCB

After the electronic equipment adopts the printed board, due to the consistency of the same type of printed board, the error of manual wiring is avoided, and the automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures the quality of the electronic equipment. , improve labor productivity, reduce costs, and facilitate maintenance.

The Development of Rigid PCB

A summary of the development trends of future printed board manufacturing technology at home and abroad is basically the same, that is, to high density, high precision, fine aperture, fine wire, fine pitch, high reliability, multi-layer, high-speed transmission, light weight, and thin direction of development.

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