Electronic Potting

First, place the electronic component or circuit board in a pot, pour the liquid into it, mix the resin and some hardener that will speed up the curing time of the liquid.
It then takes a while for the liquid to become solid, and when it solidifies, it covers the electronic components perfectly and does a good job of protecting the components from adverse environmental influences.
A successful potting solution involves many considerations. On the one hand, materials should be selected according to the application and use environment, because different materials have their own advantages and disadvantages. Common materials for electronic potting are epoxy, polyurethane, and silicone. Silicone and epoxy are suitable for high temperature environments; while polyurethane has better protection against chemical corrosion. In addition, the metering of materials should be accurate, and the mixing ratio of resin and curing agent should be correct. On the other hand, the problem of air bubbles in potting should also be avoided, so that the coating surface can be guaranteed to be smooth and uniform.