BGA Assembly service

Ball Grid Array (BGA) is an important type of surface mount packaging employed in integrated circuit boards. BGAs are mainly used for mounting high performance devices including microprocessors

What is BGA Assembly

Ball grid array (BGA) is an important surface mount package used in integrated circuit boards. BGAs are mainly used to install high-performance equipment including microprocessors. We have extensive experience and expertise in designing Ball Grid Array (BGA) packages. Equipped with advanced manufacturing and testing equipment, we can produce high-quality BGA circuit boards with high yields.

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BGA Assembly Capabilities

As one of the most well-known BGA assembly services, we are often recommended to clients who are looking for an experienced partner to realize their complex designs. The following features help us serve such customers effectively:

Micro Ball Grid Array (µBGA)

Thin Chip Array Ball Grid Array (CTBGA)

Chip Array Ball Grid Array (CABGA)

Very Thin Chip Array Ball Grid Array (CVBGA)

Very Fine Pitch Ball Grid Array (VFBGA)

Land Grid Array (LGA)

Chip scale Package (CSP)

Wafer level chip scale packaging (WLCSP)

Beneficial Features of BGA Assemblies

Over the years, BGA packages have gained immense popularity owing to the following advantages:

Reduced Package Sizes

With miniaturization becoming a major trend, BGA enables PCB assembly services like ours to meet customers' needs for tiny devices. These packages allow us to integrate various functions on one chip module by providing multiple interconnect pins. The leads follow a shorter path, which helps ensure excellent performance at high speeds.

Better Thermal Profiles

BGA packages have better heat distribution than other packages because of their low thermal resistance. This helps the heat generated by the integrated circuit to dissipate easily, preventing the chip from heating up.

Superior Electrical Performance

These packages have shorter leads, which means they have lower lead inductance. This low lead inductance ensures excellent electrical performance for high-speed boards. Inductance is the characteristic that creates unwanted signal distortion in high-speed electronic applications.

Let's work together!

If you have any PCB fabrication inquiries or PCB assembly service needs, please feel free to contact us.

E-mail

sales@fastlinkpcb.com

Call us

+86-0755-23597570

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mkt3@fastlinkpcb.com

+86-18380460893