| Item | Capability | |
|---|---|---|
| LeadTime | The delivery time of the prototype shall be 24 hours (6 hours at the earliest and expedited) and the delivery time of small batch shall be 72 hours (24 hours at the earliest and expedited). The delivery time of small-batch shall be more than 5 days. All the time shall be calculated from the next day after all components, PCB and other materials are ready. | |
| PCBA Capacity | SMT patch 4 million points/day, plug-in after welding 500,000 points/day, 50-100 orders /day. | |
| Components Service | Turnkey | With mature and effective component procurement management system, we serve PCBA projects with high-cost performance. A team of professional procurement engineers and experienced procurement personnel is responsible for the procurement and management of components for our customers. Customers choose our complete set of material replacements, which greatly reduces the procurement cost and management cost, eliminates the trouble of multi-party communication, and improves the work efficiency. |
| Kitted or Consigned | With a strong procurement management team and component supply chain, we tend to provide customers with a full range of PCBA OEM services. Customers provide us with components, we do the assembly work. In order to ensure the quality of the finished products, all the components shall be packaged in a whole package, such as plate packing and tape packing. | |
| Combo | Some components or special components are provided by customers. We are willing to provide other components for customers. Convenience for customers is the guideline of our work. | |
| PCBA Solder Type | We offer SMT, THT, or PCBA soldering services both. | |
| Solder Paste/Tin Wire/Tin Bar | We provide lead and lead-free (RoHS compliant) PCBA processing services. At the same time, according to customer requirements, we also provide customized solder paste. | |
| Stencil | We use laser cutting stencil to ensure that components such as small-pitch ICs and BGA to meet IPC-2 Class or higher. | |
| MOQ | We start with 1 piece, but we advise our customers to produce at least 5 samples for their own analysis and testing. | |
| Component Size | • Passive components: we are good at fitting the inch 01005 (0.4mm * 0.2mm), 0201 such mall components. • High-precision ICs such as BGA: We can detect BGA components with Min 0.25mm spacing by X-ray. | |
| Component Package | We accept reel, cutting tape, tubing, and pallets for SMT components. | |
| Maximum Mount Accuracy of Components (100FP) | Accuracy is 0.0375mm. | |
| Solderable PCB Type | PCB (FR-4, metal substrate), FPC, Rigid-flex PCB, Aluminum PCB. | |
| PCB Size | Min PCB size：50mm x 50mm（Need panel if your board size is smaller than 50*50mm） •Max PCB size：400mm x 1200mm. | |
| Thickness | 0.3mm ~4.5mm. | |
| File Format | BOM，PCB Gerber, Pick and Place. | |
| Testing | Before delivery, we will apply a variety of test methods to the PCBA in mount or already mount: • IQC: incoming inspection; • IPQC: in-production inspection, LCR test for the first piece; • Visual QC: routine quality check; • AOI: soldering effect of patch components, small parts or polarity of components; • X-Ray: check BGA, QFN and other high precision is hidden PAD components; • Functional Testing: Test function and performance according to customer's testing procedures and procedures to ensure compliance. | |
| Layers | 1-20 layers | 1-20 layers PCB prototypes |
| Ink | Taiyo Ink | White Ink: Taiyo 2000 Series Green Ink: Taiyo 07 Series |
| Material | CEM-1/FR-4/Aluminum | CEM-1（Kingboard KB5150） FR-4（Shengyi S1141, Shengyi S1000-H, Shengyi S1000-2M, Kingboard KB6160） Aluminum (Goldenmax GL11, Guangzhou Aluminum) |
| TG | Shengyi TG140 Kingboard TG130 Goldenmax TG130 | Shengyi TG140 / TG150 / TG170 Kingboard TG130 / TG135 / TG150 Goldenmax TG130 |
| Heat Conductivity for Alu. boards | 1.0W 1.5W 2.0W 3.0W | / |
| CTI | Class 3（CTI≥175V） | / |
| Surface Finish | HASL, immersion gold, OSP | HASL is not acceptable for 0.4mm board. |
| Solder Mask: (TAIYO) | Green ,Red, Yellow, Blue, White, Black | No extra charge (Green, White) |
| Silkscreen Color: (TAIYO) | Green ,Red, Yellow, Blue, White, Black | No extra charge (Green, Black, White) |
| Maximum Dimension | 650x520mm/640x480mm | 1/2 layers: 650x520mm 4/6 layers: 640x480mm |
| Dimension Tolerance (Outline) | ±0.15mm | ±0.15mm for CNC routing ±0.15mm for V-scoring |
| Thickness | 0.4--2.4mm | 1-2 layers: 0.4-2.4mm 4 layers: 0.8-2.4mm 6 layers: 1.2-2.4mm |
| Thickness Tolerance ( t≥1.0mm) | ± 10% | Normally take positive tolerance due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
| Thickness Tolerance ( t<1.0mm) | ±0.1mm | Normally take positive tolerance due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
| Min Trace | 4mil（0.1mm） | Minimum trace width is 4mil, strongly suggest to design trace above 6mil (0.15mm) to save cost. |
| Min Spacing | 4mil（0.1mm） | Minimum trace spacing is 4mil, strongly suggest to design trace above 6mil (0.15mm) to save cost. |
| Finished Outer Copper Thickness | 1 oz/ 2oz (35um/75um) | Thickness of outer copper foil is 1oz or 2oz 1 oz＝35um，2 oz=70um |
| Finished Inner Copper Thickness | 1 oz (35um) | Thickness of inner copper foil is 1 oz. |
| Bow and Twist | Per cater-corner length， ≤0.75% | For boards without SMT, the max. 1.5% |
| Drill Size | 0.25--6.5mm | For vias larger than 6.5mm, multiple drilling or milling is recommended |
| PTH Deviation | ±3mil | / |
| NPTH Deviation | ±2mil | / |
| Hole Position Deviation | ±3mil | / |
| Hole Wall Roughness （Max） | 1.5mil | / |
| Min Slot Width | 0.6mm | For HASL, the min. finished slot width is 0.45mm，for other surface finish, it is 0.5mm. |
| Board Thickness/Via Diameter | ≤6：1 | 7:1≤value≤8:1, add one more day for fabrication |
| PTH Deviation (Width) | ±4mil | / |
| PTH Deviation (Length) | ±5mil | / |
| NPTH Deviation (Width) | ±3mil | / |
| NPTH Deviation (Length) | ±4mil | / |
| Hole Wall Copper Thickness (Thinnest) | ≥0.71mil | / |
| Hole Wall Copper Thickness (Average) | ≥0.8mil | / |
| Via Space (Same Net) | ≥8mil | / |
| Via Space (Different Net) | ≥17mil | / |
| Min Space for Component Vias in Different Net | ≥24mil | / |
| Max. PTH (Round Hole) | 8mm | / |
| Max. PTH (Round Slot Holes) | 6*10mm | / |
| Annular Ring | ≥0.153mm（6mil） | It doesn’t limit the size of the single side of the annular ring if there is enough space. Or annular ring surrounded by traces should be equal to or larger than 6mil. |
| Finished Hole Diameter (CNC) | 0.25--6.5mm | Due to the copper attached to the inner wall of the hole, the diameter of the finished hole is generally smaller than designed. |
| Hole Size Tolerance (CNC) | ±0.075mm | e.g. For the 0.6mm hole, the finished hole size between 0.525mm to 0.675mm is acceptable. |
| Solder Mask | Photosensitive ink | Photosensitive ink is mostly adopted. Plastisol is used in the inexpensive paper-based boards. |
| Min Character Width (Legend) | ≥0.15mm | Characters width less than 0.15mm will be unidentifiable. |
| Min Character Height (Legend) | ≥0.8mm | Characters height less than 0.8mm will be unidentifiable. |
| Character Width to Height Ratio (Legend) | 1:5 | 1:5 is the most suitable ratio for production. |
| Distance between Trace and Outline | ≥0.3mm（12mil） | Ship as individual boards: Distance between Trace and Outline ≥0.3mm Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm |
| Panelization without Spacing | 0mm | Ship as Panelized boards and the spacing between boards is 0mm. |
| Panelization with Spacing | 1.6mm | Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing. |
| Half Hole Diameter | Minimum Half hole Diameter: 1.0MM, no more than 10 holes. | Half hole is a special technology, so half hole diameter should be greater than 1mm. |
| Solder Mask Bridge | 0.1mm | Please make a note, if there is solder mask bridge requirement, the price may rise. |
| Base Material | FR4 | Normal Tg | Shengyi S1141、KB6160、Huazhen H140（not suitable for lead free process ） |
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| Middle Tg | For HDI、multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662； |
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| High Tg | For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752； |
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| Halogen Free | Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165 |
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| High CTI | CTI≥600V SY S1600、Huazheng H1600HF、H1600A； | |||||
| High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 |
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| High Speed | SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I- Tera@MT40；Huazheng：H175、H180、H380 |
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| Flex Material | Base | Glue-free：Dupont AK XingyangW-type, Panosonic RF-775； | ||||
| Coverlay | SY SF305C、Xingyang Q-type | |||||
| Special PP | No flow PP： VT-447LF，Taiguang 370BL Arlon 49N Ceramic filled adhesive sheet: Rogers4450F PTFE adhesive sheet： Arlon6700、Taconic FR-27/FR-28 Double-sided coatingPI： xingyang N-1010TF-mb |
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| Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、 copperbase |
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| Special | High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250） High thermal conductivity material：92ML Pure ceramic material：alumina ceramic、Aluminum nitride ceramics BT material： Taiwan Nanya NGP-200WT |
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| Layers | FR4 | 24 | 36 | 64 | ||
| Rigid&Flex /（Flex） | 16（12） | 20（12） | 24（16） | |||
| High Frequency Mixed Lamination | 12 | 18 | 24 | |||
| 100% PTFE | 4 | 12 | 18 | |||
| HDI | 2 steps | 3 steps | 4 steps | |||
| Delivery Size (mm) |
Max(mm) | 460*560 | 460*560 | 550*900 | ||
| Min(mm) | 20*20 | 10*10 | 5*10 | |||
| Width / Gap | Inner（mil） | 0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6 3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 |
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| Outer（mil） | 1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5 2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13 5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 15 OZ base copper： 24/32 |
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| Line Width Tolerance |
＞5.0 mil | ±20% | ±20% | ±1.0mil | ||
| ≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
| Copper Thickness |
Inner layer（OZ） | 4 | 6 | 12 | ||
| Out layer（OZ） | 4 | 6 | 15 | |||
| Board thickness（mm） | 0.5-5.0 | 0.4-6.5 | 0.4-11.5 | |||
| Final Board Thickness |
＞1.0 mm | ±10% | ±8% | ±8% | ||
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
| Board thickness/drill bit | 10:1 | 12:1 | 13:1 | |||
| Contour | Bevel edge | 20～60 degree；±5degree | ||||
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | |||
| Technical Index | Mass Batch | Small Batch | Sample | ||
|---|---|---|---|---|---|
| Drilling | Min laser （mm） | 0.1 | 0.1 | 0.1 | |
| Min CNC（mm） | 0.2 | 0.15 | 0.15 | ||
| Max CNC drill bit（mm） | 6.5 | 6.5 | 6.5 | ||
| Min Half Hole(mm) | 0.5 | 0.4 | 0.5 | ||
| PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | |
| Pressing Hole | ±0.05 | ±0.05 | ±0.05 | ||
| Hole Angle (conical) | Width of upper diameter≤6.5mm：800、900、1000、1100；Width of upper diameter≥6.5mm：900； |
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| Precision of Depth-control Drilling（mm） | ±0.10 | ±0.075 | ±0.05 | ||
| Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | ||
| Minimum via hole spacing (different network, military, medical, automobile )mm | 0.50 | 0.45 | 0.40 | ||
| Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm |
0.4 | 0.35 | 0.3 | ||
| The minimum hole wall spacing of the over hole (the same network mm) | 0.20 | 0.2 | 0.15 | ||
| Minimum hole wall spacing (mm) for device holes | 0.80 | 0.70 | 0.70 | ||
| The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 >10L: 0.18 |
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| The min distance from device hole to inner copper or line | 0.3 | 0.27 | 0.25 | ||
| Welding Ring (mil) |
Via hole | 4（HDI 3mil） | 3.5（HDI 3mil） | 3 | |
| Component hole | 8 | 6 | 6 | ||
| Final Board Thickness |
＞1.0 mm | ±10% | ±8% | ±8% | |
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | ||
| CNC | contour tolerance（mm） | ±0.15 | ±0.10 | ±0.10 | |
| V-CUT Tolerance of residual thickness(mm) （mm） |
±0.15 | ±0.10 | ±0.10 | ||
| Routing slot（mm） | ±0.15 | ±0.10 | ±0.10 | ||
| Precision of controlled deep milling（mm） | ±0.15 | ±0.10 | ±0.10 | ||
| Technical Index | Mass Batch | Small Batch | Sample | |
|---|---|---|---|---|
| Solder Dam (mil) |
（solder mask） | 5 | 4 | 4 |
| （hybrid） | 6 | 5 | 5 | |
| Technical Index | Mass Batch | Small Batch | Sample | ||
|---|---|---|---|---|---|
| Surface Treatments |
Immersion gold | Ni thickness (micro inch) |
118-236 | 118-236 | 118-236 |
| Max gold (uinch) | 3 | 3 | 6 | ||
| Hard gold(Au thick) | Gold finger (uinch) |
15 | 30 | 60 | |
| NiPdAu | NI (uinch) |
118-236 | |||
| PA (uinch) |
2-5 | ||||
| Au (uinch) |
1-5 | ||||
| Graph electric gold | NI (uinch) |
120-400 | |||
| AU (uinch) |
1-3 | ||||
| Immersion tin | Tin (um) |
0.8-1.2 | |||
| Immersion Ag | Ag (uinch) |
6-10 | |||
| OSP | thick (um) |
0.2-0.5 | |||
| HAL/HAL LF | BGA pad(mm) | ≥0.3×0.3 | |||
| thickness (mm) |
0.6≤H≤3.0 | ||||
| Board thickness vs hole diameter |
Press hole≤3:1 | ||||
| Tin（um） | 2.0-40.0 | ||||
| Technical Index | Mass Batch | Small Batch | Sample |
|---|---|---|---|
| Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
| Flexible PCB Capability | |||
|---|---|---|---|
| Items | Categories | Capability | |
| General Capability | Board Size | Min（pcs） | 1*0.5mm |
| Max (Pnl Size) | 250*1200mm | ||
| Base Material Thickness | N/A | 0.06——0.3mm | |
| Board Thickness | N/A | 0.1-0.5mm | |
| Base Copper Thickness | N/A | 1/3OZ——2OZ | |
| PTH Hole Wall Copper Thickness | N/A | 8-20μm | |
| Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth) | N/A | 1:10 | |
| Blind Hole Filling Capacity (Hole Size) | N/A | 50-150μm | |
| Single Line Impedance Tolerance | N/A | ±10% | |
| Differential Impedance Tolerance | N/A | ±10% | |
| Min Track/Spacing (Double Layers Board) | Surface Copper Thickness：8-14μm | 40/40 um | |
| Surface Copper Thickness：15-20μm | 45/45 um | ||
| Surface Copper Thickness：21-30μm | 55/55 um | ||
| Surface Copper Thickness：31-40μm | 75/75 um | ||
| Surface Copper Thickness：≥40μm | 80/80 um | ||
| Line Width Tolerance | Line Width≤0.050mm | ±.02mm | |
| 0.05mm＜Line Width≤0.15mm | ±20% | ||
| Line Width＞0.150mm | ±10% | ||
| Silkscreen | Silkscreen Character Min Width/Spacing | N/A | 4mil |
| Impedance | Green Solder Mask Thickness Range | Line Surface Solder Mask Thickness | 10~30 μm |
| Related Capacity | Dimension Tolerance from Line Edge to Plate Edge | N/A | ±0.25 mm |
| Hole Size Related | Width Tolerance of White Line | Smooth Place | ±0.10 mm |
| Bump Place | ±0.20 mm | ||
| Min Drilling Hole Size | Machine Dril | 0.100 mm | |
| Min Punching Hole Size | N/A | 0.50 mm | |
| Complete Hole Size Tolerances | PTH | ±0.050 mm | |
| NPTH | ±0.025 mm | ||
| Nickel Thickness | Nickel Gold Plating | Nickel Thickness | 40~ 314U" |
| Nickel Th | ±78U" | ||
| Gold Thickness | 1.18U" ~ 40U" | ||
| Min Spacing (Golden Finger or Pad) | 35um | ||
| Nickel Gold Immersion | Nickel Thickness | 40 ~ 236 U" | |
| Nickel Th | ±40U" | ||
| Gold Thickness | 1U" ~ 3 U" | ||
| Min Spacing (Golden Finger or Pad) | 40um | ||
| OSP | OSP Thicknes | 6U"~20U" | |
| Item Category | Small and Medium Batches Order (Order area ≥10㎡) | Prototype Order (Order area < 3㎡) | |
|---|---|---|---|
| Product structure | 1+n+1; 1+1+n+1+1; 2+n+2 | 1+n+1, 1+1+n+1+1, 2+n+2 | |
| F+R, cu+F+cu, R+F+R+F+R, R+F+R | F+R, cu+F+cu, R+F+R+F+R, R+F+R | ||
| Number of layers |
Rigid-flex PCB | ≤18L | ≤24L |
| FPC | ≤10L | ≤16L | |
| Board thickness (mm) |
Rigid-flex board | 0.3-3.2 | 0.3-3.2 |
| FPC | 0.06-0.35 | 0.06-0.35 | |
| Board size (mm) |
Rigid-flex PCB | 15*15 to 310*510 | 15*15 to 310*510 |
| FPC | 5*15 to 310*510 | 5*15 to 310*510 | |
| Copper thickness (OZ) |
Maximum copper thickness of FR-4 |
Outer layer 2OZ, inner layer 2OZ | Outer layer 2OZ, inner layer 2OZ |
| Maximum copper thickness of FPC |
Outer layer 1 OZ, inner layer 1 OZ | Outer layer 2 OZ, inner layer 2 OZ | |
| Minimum copper trace width and spacing capability (um) |
75/75 | 75/75 | |
| Minimum diameter of mechanical drill (mm) | 0.2 | 0.15 | |
| Rigid part material |
Tg170 | S1000-2M,IT180A | S1000-2M,IT180A |
| High TG halogen-free | S1165 | S1165 | |
| Thickness of dielectric layer (mm) |
0.1-3.2 | 0.075-3.2 | |
| Flex part material |
Flexible material | PI DuPont, Panasonic, Shengyi | PI DuPont, Panasonic, Shengyi |
| Surface insulation layer | Cover film, soldermask | Cover film, soldermask | |
| Thickness of dielectric layer (mm) |
0.025-0.1 | 0.012-0.1 | |
| Surface treatment |
Rigid-flex board | HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP |
HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP |
| FPC | FPC | HASL with lead / lead-free, immersion gold, OSP | |
Email: sales@fastlinkpcb.com
Phone: +86 - 0755- 23597570
Tel: +86 15171508318
Head office: 3A12 ,Floor 4, JinYuan Building B , Xixiang Rd, Bao'an district, ShenZhen , China
Factory Address: 3rd floor, Building D, Baishixia Industrial Zone, Jian 'an Road, Fuhai Street, Bao 'an District, Shenzhen ,china
